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  • Mold-Tek Packaging: Board Meeting Intimation for Intimation Of The Meeting Of Board Of Directors Of The Company Inter-Alia For Fixation Of Book Closure And Other Matters Related To Ensuing 26Th Annual General Meeting For 2023.
News Announcement

Mold-Tek Packaging: Board Meeting Intimation for Intimation Of The Meeting Of Board Of Directors Of The Company Inter-Alia For Fixation Of Book Closure And Other Matters Related To Ensuing 26Th Annual General Meeting For 2023.

24-अगस्त-2023 Follow Value Research Online on Google download pdfडाउनलोड पीडीएफ़ Mold-Tek Packaging

Mold-Tek Packaging Limitedhas informed BSE that the meeting of the Board of Directors of the Company is scheduled on 29/08/2023 inter alia to consider and approve inter-alia for fixation of Book Closure and other matters related to ensuing 26th Annual General Meeting for 2023.

वैल्यू रिसर्च से पूछें aks value research information

कोई सवाल छोटा नहीं होता. पर्सनल फ़ाइनांस, म्यूचुअल फ़ंड्स, या फिर स्टॉक्स पर बेझिझक अपने सवाल पूछिए, और हम आसान भाषा में आपको जवाब देंगे.